Bell-Jar Type Evaporator Systems
Bell-Jar type simple evaporation systems are ideal for dedicated use. Up to four box type evaporators can be integrated in NVBJ-300 systems.
Load-Lock Equipped Coating Systems
Systems with Load-Lock chambers are preferable for faster/cleaner processing of samples and producing higher quality coatings at a high cycle speed.
Brazing
Systems
With brazing, similar and dissimilar materials such as ceramic-copper can be soldered in high vacuum. Degassing, annealing and sintering ability as well as brazing is offered.
e-Beam
Systems
Almost all materials of high melting temperatures can be evaporated by e-beam technique at high rates. Sequential and co-evaporation with many sources is possible.
Glove-Box Adapted Vacuum Systems
Thermal, sputtering and e-beam evaporators and vacuum furnaces with sliding doors can be adapted to Glove-Boxes to work in 1ppm H2O/O2 level dust-free N2 atmosphere.
High Power Sputtering (HiPIMS) Systems
High energy instant DC sputtering technology generates highly ionized plasma density which in turn, enables densely packed and strongly adhered thin films.
Magnetron Sputtering
Systems
All materials can be sputtered by Magnetron Guns on hot/cold and rotating sample holders to prepare multilayered films with recipes, using touch screen software control.
Plasma Chemical Vapor
Deposition (PeCVD) Systems
CVD coatings are made by cracking of gas molecules using 300W RF plasma or using thermal heating to prepare high quality “Graphene” films with CH4, Ar and H2 gases.
Space Simulator
Systems
Multiple cycles of heating and cooling in vacuum environment are generated to simulate hot and cold space environment. Cycles are programmed and data is recorded by software.
Thermal Evaporation
Systems
Layered films of many different materials can be prepared in box-type evaporation sources. Substrate heating, cooling and rotation is avaliable in 10-7 mbar vacuum level.
Thermal & Sputtering
Combined Systems
Layered films of all materials can be prepared using magnetron guns and thermal evaporation sources. Substrate heating, cooling and rotation is avaliable in 10-7 mbar.
Vacuum Furnace & Bake-Out Systems
Systems are specially developed for degassing both surface and bulk at temperatures of 50-1200°C in high vacuum. All parameters are controlled and recorded by software.
Reactive Ion Etching (RIE) Systems
Systems are designed to dry etch sample surfaces using a combination of physical and chemical reactions within an RF Plasma with gases like Ar, O2, H2, N2, etc.